Subsubsection Inverter (INV)
The inverter section contains three subassemblies called stacks, one for each phase of the output. Each stack consists of four IGBT and two diode press pack modules, a gate driver, water-cooled heat sink and balancing resistors.
The term press pack refers to the physical packaging of electronic components. It typically consists of a semiconductor chip, along with its associated control and protection circuitry, mounted between two metal plates which serve as electrical contacts and provide mechanical support. These plates are made of good thermal conductors such as copper or aluminum. This design allows for efficient heat dissipation, as the metal plates can be directly attached to a heat sink.
The IGBT gates are triggered by pulse width signals produced in the CLC section which change the direct current stored in the DC capacitors into variable voltage, variable frequency alternating current.
